Intel
Hillsboro, Oregon
Advanced Packaging Dry Etch Module Development Engineer
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Apply to Advanced Packaging Dry Etch Module Development Engineer at IntelJob details
- Location
- Hillsboro, Oregon
- Work type
- Onsite
- Compensation
- $133,800 - $255,200/yr
- Posted
- 2 weeks ago
- Apply on
- intel.wd1.myworkdayjobs.com
About this role
Master's or PhD in engineering/physical science with process development experience in semiconductor manufacturing; experience with DOE, plasma etch equipment, and driving programs to production.
What you'll do at Intel:
- developing processes
- designing experiments
- optimizing yield
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