OpenAI
San Francisco or
Advanced Packaging Multi-Physics Modeling Engineer
Job details
- Location
- San Francisco or
- Work type
- Hybrid
- Compensation
- $342,000 - $445,000/yr
- Posted
- 4 weeks ago
- Apply on
- jobs.ashbyhq.com
About this role
Lead multi-physics modeling and simulation for advanced packaging; optimize thermal, mechanical, and electrical interactions; collaborate with cross-functional teams; experience with FEA tools is preferred.
What you'll do at OpenAI:
- Leading multi-physics
- Driving co-optimization
- Developing methodologies
Apply to this Advanced Packaging Multi-Physics Modeling Engineer role at OpenAI with a tailored resume on ApplyBolt.