Intel
Phoenix or Hillsboro or Folsom or Santa Clara or Austin
Foundry Services Advanced Packaging Account Technical Solutions Engineer
Job details
- Location
- Phoenix or Hillsboro or Folsom or Santa Clara or Austin
- Work type
- Onsite
- Compensation
- $220,320 - $311,040/yr
- Posted
- Apr 15, 2026
- Apply on
- intel.wd1.myworkdayjobs.com
About this role
Experience in semiconductor packaging; strong communication, project management and customer-facing skills; ability to operate across technical and operations discussions; problem-solving; ability to explain complex technical concepts; willingness to travel.
What you'll do at Intel:
- Owns relationship
- Consult packaging
- Coordinate internally
Apply to this Foundry Services Advanced Packaging Account Technical Solutions Engineer role at Intel with a tailored resume on ApplyBolt.