Intel
Phoenix, Arizona
Mechanical Design Engineer – Semiconductor Packaging
Job details
- Location
- Phoenix, Arizona
- Work type
- Onsite
- Compensation
- $105,650 - $149,150/yr
- Clearance
- Top Secret/SCI
- Posted
- 1 week ago
- Apply on
- intel.wd1.myworkdayjobs.com
About this role
US citizen; able to obtain TS/SCI with polygraph; Bachelor's in mechanical engineering or STEM; 1+ years CAD (SolidWorks, NX, AutoCAD); strong communication and cross-functional collaboration.
What you'll do at Intel:
- design packaging
- develop drawings
- collaborate cross-functionally
Apply to this Mechanical Design Engineer – Semiconductor Packaging role at Intel with a tailored resume on ApplyBolt.