Packaging Engineering Intern - Summer
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About this role
About the role
We’re hiring semiconductor packaging engineers for the summer term. The internship begins in May or June, with the option for preferably a 4 to 8-month commitment. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies. This is a hands-on engineering role—meaning you will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. We train our interns on most of our tools and allow them to use these tools independently, including 3d printing, metal plating, lasering, and metrology.
Responsibilities
- Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
- Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
- Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
- Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)
Required Experience
- Pursuing a Bachelor’s Degree or higher in engineering
- At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
- Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
- Hands-on prototyping experience and the ability to move through design cycles quickly
Nice-to-have
- Proven experience in mechatronics or electromechanical system design
- Familiarity with lasering and 3D printing (stereolithography)
- Reliability testing, soldering, and reflow testing
- Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.)