Intel
Phoenix, AZ
Packaging Module Engineer
Job details
- Location
- Phoenix, AZ
- Work type
- Onsite
- Posted
- today
- Apply on
- intel.wd1.myworkdayjobs.com
About this role
Intel is seeking a Packaging Module Engineer in Phoenix, AZ, to contribute to the design, development, and validation of advanced semiconductor packaging solutions. This role will involve working with complex module designs and ensuring their performance and reliability for Intel's cutting-edge products.
About Intel
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