Intel
Hillsboro, Oregon
Principal Engineer, Hybrid Bonding Module
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Apply to Principal Engineer, Hybrid Bonding Module at IntelJob details
- Location
- Hillsboro, Oregon
- Work type
- Onsite
- Compensation
- $211,400 - $298,440/yr
- Posted
- Jun 1, 2026
- Apply on
- intel.wd1.myworkdayjobs.com
About this role
Expert in hybrid bonding and advanced packaging; lead module development, FOK equipment, and high-volume manufacturing readiness; strong communication and mentoring skills.
What you'll do at Intel:
- Define roadmap
- Lead development
- Drive equipment
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