Globalfoundries
Bengaluru or Richardson
Principal Engineer, Package Co-Design
Job details
- Location
- Bengaluru or Richardson
- Work type
- Onsite
- Posted
- Mar 18, 2026
- Apply on
- globalfoundries.wd1.myworkdayjobs.com
About this role
10+ years in semiconductor package co-design; Master’s or higher in Electrical, Mechanical Engineering, Computer Science, or related field; strong experience with package technologies, SI/PI, thermal; proficient with Cadence, Synopsys, Ansys, HFSS.
What you'll do at Globalfoundries:
- Lead co-design
- Define architecture
- Validate design
Apply to this Principal Engineer, Package Co-Design role at Globalfoundries with a tailored resume on ApplyBolt.