Amat
Santa Clara, California
Process Engineer – Die to Wafer Hybrid Bonding (Silicon Photonics / CPO, R&D)
Job details
- Location
- Santa Clara, California
- Work type
- Hybrid
- Compensation
- $147,000 - $202,500/yr
- Posted
- Mar 31, 2026
- Apply on
- amat.wd1.myworkdayjobs.com
About this role
MS or PhD in STEM; experience with die-to-wafer bonding, wafer-to-wafer handling, and semiconductor processing; strong problem-solving and collaboration skills.
What you'll do at Amat:
- Develop bonding
- Analyze data
- Collaborate teams
Apply to this Process Engineer – Die to Wafer Hybrid Bonding (Silicon Photonics / CPO, R&D) role at Amat with a tailored resume on ApplyBolt.