Viasat, Inc.
Tempe, Arizona
RF/Microelectronics Packaging Engineer
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Apply to RF/Microelectronics Packaging Engineer at Viasat, Inc.Job details
- Location
- Tempe, Arizona
- Work type
- Onsite
- Compensation
- $132,500 - $209,500/yr
- Posted
- 6 days ago
- Apply on
- careers.viasat.com
About this role
5+ years semiconductor packaging experience, Bachelor's in Electrical/Mechanical/Materials engineering, deep knowledge of package structures and reliability, US citizenship required, up to 10% travel.
What you'll do at Viasat, Inc.:
- developing packaging
- managing packaging
- ensuring reliability
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