Microsoft
Hillsboro or Redmond or Mountain View or Raleigh or Austin
Senior IC Packaging Engineer
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Apply to Senior IC Packaging Engineer at MicrosoftJob details
- Location
- Hillsboro or Redmond or Mountain View or Raleigh or Austin
- Work type
- Hybrid
- Compensation
- $119,800 - $234,700/yr
- Clearance
- Other
- Posted
- 1 week ago
- Apply on
- microsoft.eightfold.ai
About this role
Advanced degree in engineering or related field (or equivalent experience) with multi-year technical experience in semiconductor package development, supplier/quality management, and 2.5D/3D packaging knowledge.
What you'll do at Microsoft:
- supporting design
- driving packaging
- managing suppliers
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