Intel
Phoenix or Folsom or Santa Clara or Hillsboro or Austin
Senior Technical Solutions Engineer - Advanced Packaging
Job details
- Location
- Phoenix or Folsom or Santa Clara or Hillsboro or Austin
- Work type
- Hybrid
- Compensation
- $160,980 - $311,040/yr
- Posted
- 1 week ago
- Apply on
- intel.wd1.myworkdayjobs.com
About this role
5+ years in semiconductor packaging/related roles; bachelor's in engineering; experience with packaging, assembly, or backend manufacturing.
What you'll do at Intel:
- customer interface
- technical consultation
- coordinate resources
Apply to this Senior Technical Solutions Engineer - Advanced Packaging role at Intel with a tailored resume on ApplyBolt.