Intel
Phoenix, Arizona
Senior Yield Engineer – Substrate & Advanced Packaging
Job details
- Location
- Phoenix, Arizona
- Work type
- Onsite
- Compensation
- $133,800 - $255,200/yr
- Posted
- May 1, 2026
- Apply on
- intel.wd1.myworkdayjobs.com
About this role
Masters in engineering with 5+ years (or PhD with 3+ years) plus 3+ years in data analytics, Python, and yield/process optimization; experience with substrate/advanced packaging and big data.
What you'll do at Intel:
- Leading process
- Analyzing data
- Collaborating teams
Apply to this Senior Yield Engineer – Substrate & Advanced Packaging role at Intel with a tailored resume on ApplyBolt.