Intel
Phoenix or Chandler
Substrate Packaging Research and Development Engineer
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Apply to Substrate Packaging Research and Development Engineer at IntelJob details
- Location
- Phoenix or Chandler
- Work type
- Hybrid
- Compensation
- $133,800 - $188,890/yr
- Posted
- 6 days ago
- Apply on
- intel.wd1.myworkdayjobs.com
About this role
PhD in materials or related field, 2+ years experience, expertise in materials characterization, design of experiments, statistical analysis, and packaging process development; optics/laser experience preferred.
What you'll do at Intel:
- developing processes
- optimizing equipment
- ensuring reliability
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