Associate Electromechanical Engineer / Electromechanical Engineer

## Role overview Northrop Grumman is seeking an Associate Electromechanical Engineer / Electromechanical Engineer to join Space Sector (SP) in the Electronics & Payload Engineering organization in Rolling Meadows, IL. The qualified candidate will become part of Northrop Grumman’s Electronics and Payload Engineering homeroom, within the Mechanical / Electromechanical Design group. The primary focus for this role is electronic packaging and payload design. ## Responsibilities - Support engineering in translating mechanical requirements into functional specifications. - Assist in the design and packaging of payload ECAs, including board-level, chassis, and enclosure design. - Help manage parts lists (BOMs) and ensure designs meet system, manufacturing, and environmental requirements. - Support structural and thermal analyses to verify durability, strength, and temperature-control performance. - Design and develop environmental test fixtures for vibration, temperature, and other environmental conditions. - Participate in environmental test campaigns and assist in data collection and issue resolution. - Develop test fixtures and specialized setups for electronic- and payload-level verification. - Participate in hardware integration and test (I&T), troubleshooting issues in lab and environmental test settings. - Support material procurement activities and collaborate with vendors and supply chain to resolve technical issues. ## Basic qualifications for Associate Engineer - Be completing or have completed a bachelor’s degree from an accredited institution. - Be majoring or have majored in a STEM-related field. - Be able to obtain and maintain a U.S. security clearance. U.S. citizenship is a prerequisite. ## Basic qualifications for Engineer - Be completing or have completed a master’s degree from an accredited institution. - Be majoring or have majored in a STEM-related field. - Be able to obtain and maintain a U.S. security clearance. U.S. citizenship is a prerequisite. ## Preferred qualifications for both levels - Overall cumulative GPA of 3.50/4.0 or higher. - Experience with 3D CAD tools (NX, SolidWorks) for mechanical design and/or electronic packaging. - Coursework or experience in electronic packaging or electromechanical design; structural analysis and/or Finite Element Analysis (FEA); thermal management of electronics; or environmental testing (vibration, shock, temperature) and fixture design. - Familiarity with engineering drawings, GD&T, and configuration/documentation practices, such as managing drawings, RNs, ECNs, and BOMs. - Prior internship, co-op, senior design, or project experience involving hardware integration and test. ## Salary Associate Engineer: $72,700–$109,100. Engineer: $87,600–$131,400.