Texas Instruments
Dallas, Texas
Career Accelerator Program - Packaging Engineer
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Apply to Career Accelerator Program - Packaging Engineer at Texas InstrumentsJob details
- Location
- Dallas, Texas
- Work type
- Onsite
- Posted
- yesterday
- Apply on
- edbz.fa.us2.oraclecloud.com
About this role
Bachelor's degree in a related engineering or science field and a minimum 3.0/4.0 GPA. Preferred knowledge of SPC and semiconductor packaging, plus analytical, communication, teamwork, and project delivery skills.
What you'll do at Texas Instruments:
- developing packages
- supporting qualification
- conducting experiments
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