GE Vernova
Rochester, NY
GE Vernova Grid Solutions - Hardware Engineering Intern (Critical Infrastructure Communications) – Spring/Summer 2027
We tailor your resume to this role and apply for you in seconds.
Apply to GE Vernova Grid Solutions - Hardware Engineering Intern (Critical Infrastructure Communications) – Spring/Summer 2027 at GE VernovaJob details
- Location
- Rochester, NY
- Work type
- Onsite
- Compensation
- $52,000 - $104,000/yr
- Posted
- 2 weeks ago
- Apply on
- gevernova.wd5.myworkdayjobs.com
About this role
GE Vernova is focused on electrifying the world while helping to decarbonize it. The Hardware Engineering Co-op will contribute to hardware design projects in the communications industry, report project progress, estimate implementation and issue-resolution timelines, and apply academic knowledge to deliver project outcomes.
What you'll do:
- Learn and enhance your existing Electrical Engineering skills by applying them to hardware design for real world applications
- Experience challenging assignments in the communications industry developing products that target energy, oil and gas, mining, water/waste water, and transportation
- Receive technical training, mentorship, and coaching from world-class technologists and technical managers
- Grow your technical expertise in hardware design and expand your skills in new areas
- Gain exposure to industrialization at our onsite manufacturing plant in Rochester, NY
- Work on an assignment / project within engineering & technology to stretch your learning and skillset
- Report progress and status to project management
- Perform rough estimates of time required to implement features and resolve issues, helping with task prioritization
- Use your academic knowledge to complete assigned project(s), deliver positive outcomes, and contribute to the success of our team
What they're looking for:
- Working towards a Bachelors or Masters degree in a technical field of study in **Electrical Engineering Technology or Electrical Engineering.**
- Enrolled in a full time matriculated and nationally accredited baccalaureate or graduate program
- Completed at least two full years of college
- Must be willing to work in geographical area specified by the business
- Must have the ability to work in the US for an unlimited amount of time without sponsorship
- Minimum 3.0 GPA (without rounding)
- Must be highly self-motivated and be able to work under minimal supervision
- Ability to follow hardware design principles and development processes
- Experience with analog/digital design principles and circuitry
- Experience with schematic entry tools (Altium, Orcad, etc.)
- Experience or exposure to PCB layout (Altium, PADS, PCAD, etc.)
- Some knowledge of hardware physical layer interfaces such as Ethernet, USB, UARTs, I2C, SPI, etc
Benefits:
- Relocation Assistance: Co-op/Interns will be reimbursed for reasonable, proper, and documented expenditures incurred while initially reporting to work and returning to school/home upon completion of the assignment. Employees with a permanent address greater than 50 miles away from the work location are eligible.
- Housing Allowance: Co-op/Interns employees receive a weekly housing allowance to help off-set living expenses when the co-op/Intern’s permanent residence is at least 50 miles away from the work location.
- Employee Assistance Program, providing 24/7 confidential assessment, counseling and referral services
- GE Vernova Retirement Savings Plan (RSP) after their accumulated service reaches 90 days, and they meet any other eligibility requirements as defined in the plans. (Eligibility occurs on the 1st of the month following the 90th day.)
Ready to apply to GE Vernova?
ApplyBolt finds matching jobs, tailors your resume, and submits applications for you.