Hardware and Systems Developer Intern 2027 -New York

IBM develops compute platforms that power AI, cloud, and enterprise technologies. The Hardware and Systems Developer Intern will gain hands-on experience designing, prototyping, testing, and validating next-generation hardware across mechanical, thermal, electrical, optical, logic, materials, and process engineering areas.

What you'll do:

• Collaborate across disciplines to design, model, and validate next-generation hardware
• Support mechanical, thermal, electrical, optical, and logic design using CAD, EDA, and simulation tools
• Participate in PCB layout, power and signal integrity, circuit design, and system bring-up
• Conduct experiments, analyze data, and contribute to reliability, process, and materials development projects
• Write scripts and automation tools using Python, C/C++, or Bash to support testing and validation
• Mechanical & Thermal Design – SolidWorks, CFD, FEM, design for manufacturing, and reliability testing
• Electrical & Logic Design – PCB/IC layout (Cadence, Allegro), digital logic, circuit, and system design
• Optics & Photonics – Fiber optics, photonics, lasers (DFB, VCSEL), optical networking, and data center systems
• Materials & Process Engineering – Composites, metallurgy, heat transfer, and process development

What they're looking for:

• Bachelor's Degree
• • B.S. or M.S. student in Mechanical, Electrical, Materials, Chemical, Industrial, or related Engineering disciplines
• • Strong academic background with an interest in hardware design, optics, logic, process, or materials engineering
• • Experience with CAD tools (SolidWorks, AutoCAD, Allegro, Cadence) and/or simulation tools (CFD, FEM, HFSS)
• • Programming experience with Python, C/C++, or Bash for automation or data analysis
• • Strong analytical, problem-solving, and teamwork skills
• • Experience with test automation
• • Hands-on experience with lab tools (LabVIEW, MATLAB, oscilloscopes, thermal chambers, or optical test equipment)
• • Familiarity with design of experiments (DOE) or project management in a research or lab environment
• • Experience in signal or power integrity modeling, optical systems, logic design, or materials process engineering
• • M.S. or Ph.D. students with a research focus in electrical packaging, photonics, signal integrity, or thermal design are encouraged to apply