Apple
Cupertino or San Francisco or California or
IC Packaging Engineer
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Apply to IC Packaging Engineer at AppleJob details
- Location
- Cupertino or San Francisco or California or
- Work type
- Onsite
- Compensation
- $150,400 - $225,300/yr
- Posted
- 4 days ago
- Apply on
- jobs.apple.com
About this role
Master's degree in mechanical engineering or related field and 4 years' related experience; requires heat transfer, C++ or Python, CFD, CAD, thermal testing, fluid dynamics, and cooling-system design expertise.
What you'll do at Apple:
- architecting solutions
- running analyses
- optimizing designs
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