New College Grad - HBM Product Development Failure Analysis Engineer

Micron Technology is a world leader in memory and storage solutions that accelerate the transformation of information into intelligence. The company is seeking a New College Grad HBM Product Development Failure Analysis Engineer to perform component-level failure analysis, identify failure mechanisms, and support the reliability and yield enhancement of new HBM products. The role involves analyzing electrical, physical, statistical, and manufacturing data, collaborating cross-functionally, and using AI-enabled tools to drive product qualification and production ramp.

What you'll do:

• Perform electrical, physical, and statistical failure analysis to identify and understand component failure mechanisms
• Analyze characterization and manufacturing data to determine root causes of fabrication, assembly, and test-related failures
• Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield, reliability, and process defect issues
• Leverage AI-enabled tools and statistical methods to evaluate large datasets, identify trends, and improve component performance
• Communicate findings, corrective actions, and risk assessments to multi-functional partners to support successful product qualification and production ramp

What they're looking for:

• Bachelor's degree in Electrical Engineering, Computer Science, Physics, Materials Science, or a related technical field, or equivalent experience
• Experience or coursework in semiconductor device physics, semiconductor manufacturing processes, or VLSI design
• Demonstrated knowledge of statistical analysis techniques and data-driven problem solving
• Experience using Python or similar programming languages for data analysis and engineering applications
• Ability to analyze complex technical data and communicate findings effectively in a collaborative engineering environment
• Master's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field
• Academic or industry experience in semiconductor failure analysis, yield enhancement, reliability engineering, or product characterization
• Experience applying AI, Generative AI, or AI-assisted analytical tools to support engineering investigations and data analysis
• Knowledge of test methodologies, process integration, and advanced memory technologies, including HBM products
• Experience working with large datasets and applying statistical software or machine learning techniques to identify failure trends and process improvements

Benefits:

• A choice of medical, dental and vision plans in all locations, enabling team members to select plans that meet their family healthcare needs and budget.
• Benefit programs that help protect your income if you are unable to work due to illness or injury.
• Paid family leave.
• A robust paid time-off program.
• Paid holidays.