Texas Instruments
Dallas, Texas

Packaging Engineering Intern

OnsitePosted 1 week ago
24,855applications sent for our users this week
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Job details

Location
Dallas, Texas
Work type
Onsite
Posted
1 week ago
Apply on
edbz.fa.us2.oraclecloud.com

About this role

Currently pursuing a bachelor's degree in engineering, materials science, physics, or related field with a 3.0 GPA or higher; semiconductor packaging knowledge preferred.

What you'll do at Texas Instruments:

  • designing packages
  • analyzing technologies
  • characterizing materials

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About Texas Instruments

Texas Instruments
Dallas, Texas