Texas Instruments
Dallas or Dallas or
Packaging Engineering Intern MS/PhD
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Apply to Packaging Engineering Intern MS/PhD at Texas InstrumentsJob details
- Location
- Dallas or Dallas or
- Work type
- Onsite
- Posted
- 1 week ago
- Apply on
- edbz.fa.us2.oraclecloud.com
About this role
Currently pursuing a master's degree in a relevant engineering or science field with a 3.0 GPA. Preferred experience includes semiconductor packaging, AutoCAD, FEM modeling, fabrication, and characterization tools.
What you'll do at Texas Instruments:
- designing packages
- analyzing technologies
- characterizing materials
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