Intel
Phoenix, Arizona
Packaging Equipment Development Group Lead
We tailor your resume to this role and apply for you in seconds.
Apply to Packaging Equipment Development Group Lead at IntelJob details
- Location
- Phoenix, Arizona
- Work type
- Onsite
- Compensation
- $180,770 - $255,200/yr
- Posted
- 2 weeks ago
- Apply on
- intel.wd1.myworkdayjobs.com
About this role
Bachelor's degree with 9+ years, master's with 6+ years, or PhD with 4+ years in a relevant engineering or science field; semiconductor packaging equipment development and process integration experience required.
What you'll do at Intel:
- leading engineers
- developing equipment
- optimizing processes
Apply to this Packaging Equipment Development Group Lead role at Intel with a tailored resume on ApplyBolt.
Ready to apply to Intel?
We tailor your resume to this role and apply for you.