Packaging Process Engineer - Nova Sensor Fremont

WHO WE ARE

At NovaSensor, an Amphenol company, we are pioneers in high accuracy sensing solutions. As a global leader in MEMS (Microelectromechanical Systems) technology, we design and manufacture advanced pressure sensors that power critical applications across the medical, automotive, industrial, and consumer markets—whether it's enabling life-saving medical devices, enhancing vehicle safety and efficiency, or ensuring reliability in industrial systems.

We are part of Amphenol, a global leader in advanced interconnect systems, serving diverse markets including automotive, aerospace, industrial, and mobile devices. Amphenol Corporation, a member of the Fortune 500 (NYSE: APH), was established in 1932 and has pioneered innovation in electronics for nearly a century across virtually every end market.

ABOUT THE ROLE

As a Packaging Process Engineer, you’ll design, validate, and refine advanced manufacturing techniques. You'll team up with others to develop state-of-the-art tooling and automation solutions that scale with next-generation product lines and delight our customers. 

WHAT YOU WILL DO

• Lead the development and continuous improvement of MEMS pressure sensor assembly processes to enhance performance, quality, and manufacturability.
• Design, develop, and validate MEMS assembly processes for both production and prototype builds, including techniques such as wire bonding, die attach, overmolding, and encapsulation, with optimal materials selection.
• Drive product yield improvements and production efficiency through the application of Lean Manufacturing and Six Sigma principles.
• Design, develop, and implement advanced tooling, fixtures, and equipment solutions to support scalable and reliable manufacturing.
• Collaborate within a cross-functional Engineering team to conceptualize and implement flexible assembly and test platforms for future product lines.
• Conduct hands-on work in a Class 1000 cleanroom environment (approximately 10% of total work time)
• Support global operations with occasional domestic and international travel as required.

WHAT YOU BRING ALONG

• A Bachelor’s degree in Manufacturing Engineering, Mechanical or Electrical Engineering or a related discipline
• Minimum three years of hands-on engineering experience in a high-volume manufacturing environment, ideally within the semiconductor, MEMS or sensor industry.
• Proven expertise in IC or MEMS packaging processes, including wire bonding, die attach, encapsulation, materials selection, and operation of micro-packaging equipment.
• Strong working knowledge of core quality and process tools such as Design of Experiments (DOE), Failure Mode & Effects Analysis (FMEA), Control Plans, and Statistical Process Control (SPC).
• Demonstrated success in developing or supporting products in regulated sectors such as automotive or medical devices.
• Ability to perform effectively in a cleanroom environment while adhering to all required gowning and safety protocols.
• Proficiency in Microsoft Office applications, including Excel, Word, PowerPoint, Project, and Access.
• Apply expertise in workstation layout, design optimization, and ergonomic principles to enhance manufacturing efficiency and operator performance.
• Demonstrate strong written and verbal communication skills, with the ability to produce clear technical documentation and collaborate effectively with internal teams and customers.
• Exhibit a proactive, self-motivated approach with a proven ability to work across multiple projects, meet deadlines, and contribute effectively within cross-functional teams.

WHERE YOU WILL WORK

• On-site in Fremont, CA

What we offer

• Competitive salary 
• 401(k) 
• Health insurance and wellness programs
• 401(k) with company match
• Professional onboarding and training opportunities
• Paid time off
• Health savings account
• Flexible spending account
• Life insurance

• Inclusive and collaborative work environment