Job Summary

Process Assembly Technician for the wire bonding of focal plane arrays. This includes, but is not limited to, piece part handling, chemical handling, device inspection (optical microscope), and device assembly.

Job Responsibilities

• Provide technical support to engineers and scientist on moderately complex components, devices, material, products, processes and/or equipment
• Responsible for testing, modifying, reworking, and repairing electronic, optical and mechanical assemblies
• Work from moderately complex wiring and assembly drawings, operation sheets, engineering specifications and sketches
• Design and test prototype assemblies and production units
• Use judgment in re-working or re-wiring to bring unit within quality control specifications
• Test, inspect, and repair electronic, optical or mechanical assemblies
• Work under minimal supervision and may provide guidance to other technicians
• Capable of performing related manufacturing processes
• Interpret and follow written documents such as SOPs and safety rules
• Ensure compliance with all safety and regulatory requirements applicable to the company in accordance with State and Federal regulations and any applicable certification required to maintain the certification
• May assist in training new team members
• Interface with other departments to assure efficient flow of information and materials
• Perform Key Performance Indicators:
• Meet production deadlines
• Quality of finished product (Pass/fail rates)
• Raw material stock levels
• Compliance outcomes
• Ability to coordinate several activities at the same time, and to reprioritize in response to changing operational conditions
• Support, communicate, reinforce and defend the mission, values and culture of the organization
• Operate various types of manufacturing, material growth reactors and or process equipment to conduct complex experiments or to grow custom materials

Qualifications

•    High School diploma is required.    
•    2 or more years of equivalent technical experience in wire-bonding, semiconductor device processing and testing, or semiconductor material handling. Direct experience in wire-bonding desired.
•    Ability to work with minimal direct supervision. 
•    Capable of working in a clean room environment. Work experience in a Class 100 clean room is recommended.
•    Good manual dexterity.
•    Good communication skills both written and verbal. 
•    Attention to detail and excellent data collection, documentation and reporting skills.
•    Balance throughput requirements between different product areas with coordination between engineering and operations personnel including technicians, operators, planning, and other product areas.
•    Must be able to work autonomously as well as in a team environment.

Required Competencies

•    Working knowledge with computer skills such as Microsoft Excel, Word, and floor control or manufacturing execution systems (MES).

Working Conditions

•    Primarily non-cleanroom area
•    Secondary class 100 Semiconductor Cleanroom

Desired Skills

• Experience in wirebonding of semiconductor devices.
• Familiarity with automated and manual wirebonders.
• Ability to work with capillary setup and simple wirebonder maintenance a strong plus.
• Familiarity with wafer/piece part processing including manual handling of individual devices.
• Clean-room experience with photolithography tools, optical microscopes, Nanospec etc is a plus.