Research Scientist - Multiscale Modeling Summer 2027 Intern

## Summer 2027 Internship Duration: Monday, May 17th- August 20th, 2027 Location: Austin, TX ## What You Can Expect: - Meaningful Project Work: Every Intern is assigned a project that delivers value to the business. - Lean Thinking: Interns are expected to apply Lean principles and continuous improvement thinking throughout their project work; Lean training and resources will be provided. - Our Goal is to provide interns with meaningful, hands-on experiences that contribute to business objectives while supporting their professional developmentTokyo Electron America, Inc., a subsidiary of Tokyo Electron Limited, a global multi-billion-dollar corporation and leader in the semiconductor equipment industry, is seeking research scientist interns. Tokyo Electron markets a wide range of semiconductor production equipment (SPE) products and provides outstanding service and support to semiconductor device manufacturers. TEL's world-renowned products and technologies support diverse customer needs for the manufacturing of increasingly sophisticated semiconductors. An internship at TEL is a great opportunity for a student to gain valuable experience while engaging in technically challenging projects that provide value by advancing our technology. ## Position Summary TEL is seeking a summer intern with expertise in Multiphysics modeling, transport phenomena, and computational simulation to work in the Surface Preparation System (SPS) Advanced Technology Group (ATG) located in Austin, Texas. This intern will support the development of a novel multiscale modeling framework for semiconductor wet processing applications, with a focus on connecting wafer-scale transport phenomena and nanoscale feature etching behavior. ## Responsibilities - Develop physics-based models describing transport and reaction phenomena in wet chemical semiconductor processing. - Build multiscale simulation frameworks linking wafer-scale flow, species transport, and thermal behavior to nanoscale feature etching dynamics. - Analyze simulation and experimental data to validate model predictions across a range of process parameters including wafer spin speed, chemical composition, dispense conditions, and temperature. - Support the development of advanced simulation methodologies for process optimization, technology development, and digital-twin implementation. - Collaborate on global projects with TEL U.S. R&D sites, manufacturing divisions, semiconductor customers, consortia, vendors, and academic partners. - Demonstrate strong problem-solving skills, structured project management, and the ability to work effectively within multidisciplinary teams. ## Qualifications - B.S. degree or higher (pursuing M.S. or Ph.D. preferred) in Engineering, Applied Mathematics, Physics, Computational Engineering, Materials Science, or related fields. - Strong understanding of transport phenomena including fluid dynamics, mass transfer, diffusion, convection-diffusion-reaction systems, and surface reaction kinetics. - Knowledge of multiscale modeling methodologies and reduced-order modeling techniques is desirable. - Familiarity with Macro transport Theory, homogenization methods, or other scale-bridging approaches is desirable. - Experience modeling transport in confined geometries, porous media, microfluidics, or high-aspect-ratio structures is desirable. - Experience with programming languages such as Python, MATLAB, C/C++, or Julia is desirable. - Experience with data-driven modeling, machine learning, or surrogate modeling approaches is a plus. - Relevant semiconductor manufacturing experience and/or knowledge of wet etching, wet cleaning, deposition, or advanced process technologies is preferred. - Experience working in a global and multicultural environment is preferred. - Excellent written and oral communication skills, including the ability to explain complex technical concepts to diverse technical audiences.