Hakkōda, an IBM Company
Albany, NY
Silicon Technology Research and Development Hardware Engineering Intern 2027
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Apply to Silicon Technology Research and Development Hardware Engineering Intern 2027 at Hakkōda, an IBM CompanyJob details
- Location
- Albany, NY
- Work type
- Onsite
- Visa
- Sponsorship available
- Posted
- 1 week ago
- Apply on
- careers.ibm.com
About this role
IBM Research is seeking intern candidates to apply their classroom learning to real-world challenges. The Hardware Engineer Intern will support semiconductor research by investigating innovative hardware designs and applications across chip architecture, design, fabrication, testing, and advanced packaging, while analyzing complex problems and developing creative solutions.
What you'll do:
- As a Hardware Engineer Intern in semiconductor research, you will work with world-class global researchers focused on enabling next-generation chips and systems that support the tremendous processing power and unprecedented speeds required for next generation logic/memory technology and support applications such as quantum silicon and artificial intelligence
- In this role, you will investigate the feasibility of applying science and engineering principles towards innovative, new hardware design and applications from state-of-the-art chip architecture, design, fabrication and test to advanced chip packaging
- Interns are expected to have the ability to analyze complex problems and apply creative solutions to groundbreaking hardware engineering projects
What they're looking for:
- Background knowledge of engineering disciplines, computer science, physics, or materials science are ideal skills for this role
- Interns are expected to have the ability to analyze complex problems and apply creative solutions to groundbreaking hardware engineering projects
- Electrical engineering/Mechanical Engineering/Computer Science/Materials Engineering/Physics/Chemistry Semiconductor fabrication knowledge and/or coursework
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