HP Inc.
San Francisco, California
Software Engineering Intern, Connectivity (Summer 2027)
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Apply to Software Engineering Intern, Connectivity (Summer 2027) at HP Inc.Job details
- Location
- San Francisco, California
- Work type
- Onsite
- Compensation
- $93,600 - $106,080/yr
- Posted
- 4 days ago
- Apply on
- job-boards.greenhouse.io
About this role
Student internship requiring software development in C, C++, or Python, wireless connectivity protocols, embedded systems, debugging, testing, and collaboration with hardware and software teams.
What you'll do at HP Inc.:
- developing firmware
- debugging software
- testing features
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