Software Engineering - PhD Intern

Job Description

The Role and Impact

Intel is seeking a highly motivated Software Research Intern (PhD) to join the TCAD Process Reliability Modeling team within Intel Foundry. This internship offers an opportunity to work on advanced computational software solutions supporting semiconductor technology development. The selected candidate will contribute to cutting-edge software applications and solution methodologies like chip-package interactions, thermal transport and thermal management, thin films development and patterning.

The internship is designed for PhD students interested in applying software engineering and research expertise to solve complex engineering challenges while collaborating with multidisciplinary teams across Intel. 

Business Group

The Intel Foundry Technology organization is focused on driving semiconductor process innovation and enabling future technology nodes. Within the LTD-TD TCAD team, engineers and researchers develop advanced simulation, modeling, and software solutions used to accelerate technology development. The team fosters a collaborative environment where software, mathematics, physics, and engineering intersect to solve challenging technical problems.

Key Responsibilities

• Design, develop, and optimize software solutions for engineering and research applications. 
• Develop simulations capabilities using numerical methods like finite element, level sets, or related techniques. 
• Develop modeling-based methodologies to solve device and interconnect process, module and reliability problems.
• Establish criteria and methods to determine proper inputs and validate results. 

• Collaborate with software engineers, researchers, and domain experts to deliver scalable and maintainable solutions. 

• Document technical solutions and present findings to project stakeholders.

Qualifications

Minimum Qualifications

• Must be a full-time student pursuing a Ph.D. degree in Electrical Engineering, Material Science, Mechanical Engineering, Chemical Engineering or a semiconductor-related field.
• Must have a minimum of a 3.0 GPA in college courses to date.
• 1+ year experience programming in C/C++/Python or equivalent.
• Strong analytical, problem-solving, and software development skills.

Preferred Qualifications

• Experience with using TCAD or atomistic simulation tools to study thermo-mechanical and chip/package interactions, thermal transport, thin film deposition processes, patterning, material chemical interactions or circuit performance.
• Hands on experience development and/or using finite element or equivalent solvers for solutions of physical systems.
• Experience with physics-based modeling, AI/machine learning methodologies for the analysis of solid mechanics, thermal management, reliability and manufacturing process of microprocessors devices.
  
  

This is your opportunity to develop your expertise, gain hands-on experience, and make a meaningful impact within a collaborative environment that drives the future of technology. We look forward to seeing how your skills and passion will contribute to our innovative team.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.



Annual Salary Range for jobs which could be performed in the US
*Salary range dependent on a number of factors including location and experience

Working Model

This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.