Solutions Engineer - AE

RemotePosted 1 week ago

Job details

Work type
Remote
Posted
1 week ago
Apply on
cadence.wd1.myworkdayjobs.com

About this role

Bachelor's degree in electrical/electronics engineering (Master's preferred) with 10+ years in semiconductor packaging, IC packaging, PCB, substrate, or interposer design; strong knowledge of advanced package design, 2.5D/3D-IC integration, chiplet architectures, and package signoff; excellent communication and presentation skills.

What you'll do at Cadence:

  • providing technical support
  • developing design workflows
  • delivering presentations

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